ASMC 2020 to Go Virtual with Latest Insights in Advanced Semiconductor Manufacturing
MILPITAS, Calif. — June 29, 2020 OpinePR 🎯 — Industry leaders and visionaries will gather in virtual format August 24-26, 2020, for the SEMI Advanced Semiconductor Manufacturing Conference (ASMC) to provide the latest insights and developments across a wide range of critical industry topics from yield management to metrology in the era of artificial intelligence (AI). The conference will feature more than 35 hours of technical content – presented live and available on-demand – on leading-edge semiconductor manufacturing strategies and methodologies. Registration is now open.
The live panel discussion Exascalers, Hyperscalers: Computing at the Edge – Different Modes, Different Nodeswill highlight the conference. Panelists will include experts from industry leaders including Applied Materials, Binghamton University, Corning, IBM Global Think Labs and Tercero Technologies. In addition, a tutorial presented by Intel and Entegriswill focus onContamination Control: Enabling High-Yield Manufacturing.
Now entering its fourth decade, ASMC is the premier event for industry professionals to network and share best practices for semiconductor manufacturing. The conference is co-chaired by Fred Bouchard of SpareTech and Armando Anaya of Northrop Grumman.
ASMC 2020 Keynotes
ASMC 2020 technical tracks include:
Advanced Equipment Processes and Materials
Advanced Metal Structures
Advanced Process Control
Novel Metrology Techniques
Optical Metrology and Machine Learning
Patterning and 3D Metrology
Yield Enhancement/Yield Methodologies
For more conference details, contact Margaret Kindling at firstname.lastname@example.org or 1.202.393.5552. The media should contact Scott Stevens (for SEMI Americas communications) at email@example.com for registration information.
SEMI Golden Anniversary
2020 marks SEMI’s golden anniversary. For half a century, SEMI has brought the industry together to connect, collaborate, innovate, and help transform the world with new technologies.
Join us at SEMICON events around the world as we celebrate 50 years of growth in global electronics manufacturing and kick off the next 50 years by highlighting the latest developments, trends and innovations in smart technologies.
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.
Scott Stevens, Cardinal Communications for SEMI Americas Phone: 1.512.288.4050 Email: firstname.lastname@example.org